Originally Aired - Wednesday, January 29 • 4:00 PM - 5:15 PM Pacific Time (US & Canada)
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Location: Ballroom B
Title: Panel – The Need for Speed & Sustainability in Datacenters for AI: Can CPO Take Us There?
Session Handouts Available Upon Speaker Approval: 1
Description:
As datacenters face increasing demands for efficiency and bandwidth, particularly with the rise of AI and ML technologies, optics is set to play a crucial role in future interconnect architecture and performance. Co-packaged optics (CPO) in particular, shows great promise to meet these demands while minimizing cost and power consumption via dense vertical integration of electronic and photonic components within the 3DIC architecture. However, it also has its own challenges, such as new packaging, thermal management, and optical coupling designs that need to be robust and cost-effective. Key considerations include lasers source integration (on-chip vs. off-chip), thermal management and system reliability. Also, optical power delivery in CPOs must address increasing fiber density, thermal management, reliability, alignment, scalability, and standardization. This panel will gather photonic industry experts to discuss the strategic use of optical technologies to meet datacenter demands. Topics include future trends like heterogeneous integration, co-design for electro-optical systems, and packaging innovations, alongside challenges in design complexity, manufacturability, yield, and cost. Key questions will focus on the design consideration for CPO architectures, the industry’s development status and adoption readiness for CPO. Attendees will gain insights into the complexities and solutions driving the next generation of efficient, high-performance datacenter interconnects.
Type: Panel Discussion
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